Guilin Lasercom Technologies Co., Ltd.

JOINT VENTURE

· GLSUN Science and Tech Co.LTD, CHINA

· AGX Technologies, Inc., USA

GOAL

· Become the premier laser diode manufacturer in China

LASERCOM STRENGTHS

· Staff with strong combination of proven experience in design and production of high performance and high volume laser diode chips.

· Many proprietary designed tools and processes improve yields and throughput relative to competitors.

· Experienced in both BH and Ridge designs and processing.

· BH for high performance & Ridge for lower cost.

WAFERFAB DESIGN

· Designed from ground up for manufacturing efficiency in laser diodes.

· Initial target DFB chip capacity 2KK/month.

· Low operating cost & High efficiency layout.

· State-of-art design, optimized for manufacturing semiconductor laser diodes.

· Heavy use of automated/semi-automated processing equipment.

· Initial target DFB chip capacity 2KK/month.

· Expandable to 5KK/month with additional equipment.

EXPERIENCED ENGINEERING & MANAGEMENT

· Engineering, R&D, and management staff previous accomplishments. · Held primary production roles in Finisar, Ortel/Emcore, and Archcom waferfabs.

· Built two waferfabs for laser diode manufacturing in the USA.

· Created world-leading manufacturing facility and business in pointer lasers.